Products

From memory chips to complete drives, covering mainstream capacities and interfaces.

Seven product lines serve different customers and assembly scenarios; specifications and parameters are detailed on the product page.

DDR4 / DDR5 / LPDDR4X

Covers common consumer and industrial capacities; provides batch-specific labels and test records.

SLC / MLC / TLC / QLC

From industrial-grade SLC to consumer-grade TLC, covering diverse lifespan and capacity requirements.

UDIMM / SODIMM

Desktop and laptop storage capacities are commonly available in stock and can be delivered with SSDs.

RDIMM / ECC

Designed for rack and tower servers. Heatsink specifications are available upon request.

eMMC / UFS

Designed for industrial control and automotive applications with wide-temperature specifications; supports small-batch prototyping.

SATA / NVMe

Available in two sizes: M.2 and 2.5 inches.

B300 / 8 Card GPU Chassis

GPU servers for AI training and inference: power, cooling, and network configured per project.

Size Comparison

Product Line	Representative Specification	Key Parameters	Typical Use Cases
DRAM memory chips	DDR5 16Gb	FBGA Package / 1.1V / 4800–6400 MT/s	Memory modules and embedded devices
NAND flash memory chips	TLC 512Gb	ONFI 4.0 / BGA152 / TSOP48	SSD, USB Flash Drives, and Embedded Storage
Consumer-grade RAM	DDR5 16GB	UDIMM / SODIMM / 1.1V	Desktops and Laptops
Server Memory	RDIMM 64GB	ECC / 4800–6400 MT/s	Rack and Tower Servers
Embedded Storage	eMMC 64GB	BGA153 / Wide Temp. -25°C~85°C	Industrial Control, In-Vehicle, and Terminal Devices
Solid State Drive (SSD)	NVMe 1TB	PCIe 4.0 / TLC	Desktops, Laptops, and Upgrade Markets
Complete Server	B300 8 Card Unit	GPU Accelerator / Air-cooled or Liquid-cooled	AI Training, Inference, and High-Performance Computing

Specifications in the table are representative models only; actual model and pricing subject to inquiry confirmation.